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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC1093
ADJUSTABLE PRECISION SHUNT REGULATORS
DESCRIPTION
The PC1093 are adjustable precision shunt regulators with guaranteed thermal stability. The output voltage can be set to any value between reference voltage (2.495 V) and 36 V by two external resistors. These ICs can apply to error amplifier of switching regulators.
FEATURES
* High Accuracy * Low Temperature Coefficient * Adjustable Output Voltage by two External Resistors * Low Dynamic Impedance VREF = 2.495 V 2 %
VREF/T 100 ppm/C
VREF VO 36 V | ZKA | = 0.1 TYP.
ORDERING INFORMATION
Part Number Package 3-pin plastic SIP (TO-92) 8-pin plastic SOP (225 mil) Power mini mold (SOT-89) 5-pin plastic mini mold (SC-74A)
PC1093J PC1093G PC1093T PC1093TA
The information in this document is subject to change without notice. Document No. G10634EJ5V0DS00 (5th edition) (Previous No. IC-1791) Date Published September 1998 N CP(K) Printed in Japan
The mark
shows major revised points.
(c)
1986
PC1093
EQUIVALENT CIRCUIT
K
R5
R6 Q6
Q12 Q13 Q14 Q15 Q16 Q17 C2
REF
Q1
Q5
Q2 Q7 R1 R7 D1 C1 R2 Q3 R3 Q8 Q4 R4 R8 Q9
Q10 R9 R10
Q11
A
PIN CONFIGURATION (Marking Side)
3-pin plastic SIP (TO-92) * PC1093J 8-pin plastic SOP (225 mil) * PC1093G
K
1 2 3 4
8 7 6 5
REF NC A NC
1
2
3
NC NC NC
1 : REF 2:A 3:K
Power mini mold (SOT-89) * PC1093T
A
5-pin plastic mini mold (SC-74A) * PC1093TA
NC 5 A 4 REF : Reference A : Anode K : Cathode NC : No Connection
1 K
2
3
A REF
1 2 REF A
3 K
2
PC1093
ABSOLUTE MAXIMUM RATING (TA = 25 C, unless otherwise specified.)
Parameter Cathode Voltage Cathode Current Cathode-Anode Reverse Current Reference Voltage Reference Input Current Reference-Anode Reverse Current Power Dissipation Symbol VKA IK -IK VREF IREF -IREF PT Ratings 37 150 -100 7 50 -10 700 480 400/2 000Note 1 180/510Note 2 TA Tstg -20 ~ +85 -65 ~ +150 C C Unit V mA mA V
A
mA mW
PC1093J PC1093G PC1093T PC1093TA
Operating Ambient Temperature Storage Temperature
Notes 1. with 16
cm2
x 0.7 mm ceramic substrate
2. with 75 mm2 x 0.7 mm ceramic substrate Caution Exposure to Absolute Maximum Ratings for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently. The device should be operated within the limits specified under DC and AC Characteristics.
RECOMMENDED OPERATING CONDITIONS
Parameter Cathode Voltage Cathode Current Power Dissipation Symbol VKA IK MIN. VREF 1 TYP. 5 10 50 50 50 50 TA -20 MAX. 36 100 220 150 125/640Note 1 58/160Note 2 +85 C Unit V mA mW
PC1093J PC1093G PC1093T PC1093TA
PT
Operating Ambient Temperature
Notes 1. with 16 cm2 x 0.7 mm ceramic substrate 2. with 75 mm2 x 0.7 mm ceramic substrate
3
PC1093
ELECTRICAL CHARACTERISTICS (TA = 25 C, IK = 10 mA, unless otherwise specified.)
Parameter Reference Voltage Reference Voltage Deviation Over Temperature Reference Voltage Deviation Over Cathode Voltage Reference Input Current Reference Input Current Deviation Over Temperature Minimum Cathode Current Off-state Cathode Current Dynamic Impedance IREF Symbol VREF VKA = VREF 0 C TA 70 C, VKA = VREF | VREF | VKA 10 V 10 V VKA 36 V VKA = VREF, R1 = 10 k, R2 = 0 C TA 70 C, VKA = VREF, R1 = 10 k, R2 = VKA = VREF, VREF = 2 % VKA = 36 V, VREF = 0 VKA = VREF, f 1 kHz 1 mA IK 100 mA Conditions MIN. 2.440 TYP. 2.495 7 MAX. 2.550 17 Unit V mV
VREF VREF/V
1.2 0.7 1 0.4
2.7 2 4 1.2
mV/V mV/V
A A
mA
IREF
IK min. IK off | ZKA |
0.4 0.1 0.1
1 1 0.5
A
TEST AND APPLICATION CIRCUIT
VIN
R0
VOUT R1 REF
K VOUT A (1+ R1 . ) VREF R2
R2
GND
4
PC1093
TYPICAL CHARACTERISTICS
Pd vs TA ( I )
0.8
Pd vs TA ( II )
(with 16 cm2x0.7 mm ceramic substrate)
PC1093J
180 C/W
Pd - Power Dissipation - W
2.0
Pd - Power Dissipation - W
PC1093T
62.5 C/W
0.6
PC1093G
260 C/W 0.4
1.6
1.2
PC1093T
315 C/W
0.8
0.2
PC1093TA
0.4
PC1093TA
695 C/W 0 100 20 40 60 80 TA - Operating Ambient Temperature - C
245 C/W
(with 75 mm2x0.7 mm ceramic substrate) 0 20 40 60 80 100 TA - Operating Ambient Temperature - C
VREF vs TA
20
VREF - Reference Voltage Deviation - mV
IK vs VKA ( I )
1.2 IK = 10 mA VKA = VREF TA = 25 C VKA = VREF 1.0
IK - Cathode Current - mA
10
0.8
0
0.6
-10
0.4
-20
0.2
-30 -25
0 50 75 100 25 TA - Operating Ambient Temperature - C
0
1 2 VKA - Cathode Voltage - V
3
VREF vs VKA
20
VREF - Reference Voltage Deviation - mV
IK vs VKA ( II )
150 TA = 25 C VKA = VREF 100
IK - Cathode Current - mA
TA = 25 C IK = 10 mA 10
0
50
-10
0
-20
-50
-30 0 10 20 30 VKA - Cathode Voltage - V 40
-100 -2
-1
0 1 2 VKA - Cathode Voltage - V
3
5
PC1093
IREF vs TA
3 0.3 VKA = VREF, IK = 10 mA R1 = 10 k , R2 =
IK off vs TA
VKA = 36 V VREF = 0
2
IK off - Off-state Cathode Current - A
IREF - Reference Input Current - A
0.2
1
0.1
0 -25
0
25
50
75
100
0 -25
0
25
50
75
100
TA -Operating Ambient Temperature - C
TA -Operating Ambient Temperature - C
ZKA vs f
VIN - Input Voltage - V
100 TA = 25 C VKA = VREF 1 mAIK100 mA 10 TA = 25 C VKA = VREF RO = 220
Pulse Response
ZKAI - Dynamic Impedance -
5
0
VREF - Reference Voltage - V
1
3 2 1 0 0 2 4 6 T - Time - s 8 10
0.1
0.01 100
1k
100 k 10 k f - Frequency - Hz
1M
Av vs f
60
Av - Voltage Gain - dB
40
20
220 IK o in
~
10 k 10 k
0
-20 1k
(IK = 10 mA) 10 k 100 k 1M f - Frequency - Hz 10 M
6
PC1093
STABILITY AREA
100 a : VKA = VREF 90 b : VKA = 5 V 80 c : VKA = 10 V d : VKA = 15 V 70 60 50 40 30 20 10 0 0.001 0.01 0.1 CKA - Load Capacitance - F 1 10 Unstable
TEST CIRCUIT
a 150 IKA CKA
a b Stable d a c c b
IKA - Cathode Current - mA
Stable
b, c, d 150 IKA R CKA 10 k CKA : Monolithic Ceramic Capacitors
Caution of Stability Area If the Aluminum electrolytic capacitor is used, it should be kept CKA 2.2 F. When using plural different types of capacitors, each capacitor is needed to be stable independently. When designing a circuit, take the characteristic variation among devices into consideration, so that the designed circuit has an enough characteristic margin supporting the standard specifications described above.
7
PC1093
PACKAGE DRAWINGS
3 PIN PLASTIC SIP (TO-92)
A
N
M 1 3
Y
H F
J G
M
V
U
NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition.
ITEM A F G H J M N U V Y
MILLIMETERS 5.00.2 0.5 +0.3 -0.1 0.12 1.27 1.33 MAX. 5.00.5 4.00.2 2.8 MAX. 0.50.1 15.00.7 P3J-127B-2
8
PC1093
8 PIN PLASTIC SOP (225 mil)
8 5
detail of lead end
P
1 A
4
H F G I J
S B E D
NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition.
L K N S
C M
M
ITEM A B C D E F G H I J K L M N P
MILLIMETERS 5.2 +0.17 -0.20 0.78 MAX. 1.27 (T.P.) 0.42 +0.08 -0.07 0.10.1 1.590.21 1.49 6.50.3 4.40.15 1.10.2 0.17 +0.08 -0.07 0.60.2 0.12 0.10 3 +7 -3 S8GM-50-225B-5
9
PC1093
POWER MINI MOLD (SOT-89) (Unit: mm)
4.50.1 1.60.2 1.50.1
0.8 MIN.
0.420.06 1.5 3.0 0.47 0.06
0.420.06
4.00.25
2.50.1
0.41+0.03 -0.05
10
PC1093
5 PIN PLASTIC MINI MOLD
detail of lead end F G
R E A H B I J L
S
C D M
M
N K
S
ITEM A B C D E F G H I J K L M N R MILLIMETERS 2.90.2 0.3 0.95 (T.P.) 0.32 +0.05 -0.02 0.050.05 1.4 MAX. 1.1+0.2 -0.1 2.80.2 1.5+0.2 -0.1 0.65 +0.1 -0.15 0.16 +0.1 -0.06 0.40.2 0.19 0.1 55 S5TA-95-15A
11
PC1093
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (C10535E). Through-hole device
PC1093J: 3-pin plastic SIP (TO-92)
Process Wave soldering (only to leads) Solder temperature: 260 C or below, Flow time: 10 seconds or less. Conditions
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. Surface mount devices
PC1093G: 8-pin plastic SOP (225 mil)
Process Infrared ray reflow Conditions Peak temperature: 230 C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 C or higher), Maximum number of reflow processes: 1 time. VPS Peak temperature: 215 C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 C or higher), Maximum number of reflow processes: 1 time. Solder temperature: 260 C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 C or below (Package surface temperature). VP15-00-1 Symbol IR30-00-1
Wave soldering
WS60-00-1
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
12
PC1093
PC1093T: Power mini mold (SOT-89)
Process Infrared ray reflow Conditions Peak temperature: 235 C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 C or higher), Maximum number of reflow processes: 2 times. Peak temperature: 215 C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 C or higher), Maximum number of reflow processes: 2 times. Solder temperature: 260 C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 C or below (Package surface temperature). Symbol IR35-00-2
VPS
VP15-00-2
Wave soldering
WS60-00-1
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
PC1093TA: 5-pin plastic mini mold (SC-74A)
Process Infrared ray reflow Conditions Peak temperature: 235 C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210 C or higher), Maximum number of reflow processes: 3 times. Peak temperature: 215 C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200 C or higher), Maximum number of reflow processes: 3 times. Solder temperature: 260 C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120 C or below (Package surface temperature). Symbol IR35-00-3
VPS
VP15-00-3
Wave soldering
WS60-00-1
Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress.
13
PC1093
REFERENCE DOCUMENTS
Quality Grades on NEC Semiconductor Devices Semiconductor Device Mounting Technology Manual IC Package Manual Semiconductors Selection Guide NEC Semiconductor Device Reliability/Quality Control System -Three Terminal Regulator C11531E C10535E C10943X X10679E IEI-1212
REMARK OF THE PACKAGE MARK
The package marks of the PC1093T and the PC1093TA are the symbols as follows.
Part Number Mark 93 K93
PC1093T PC1093TA
14
PC1093
[MEMO]
15
PC1093
[MEMO]
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
M4 96.5

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